Silane or borane treatment of metal thin films

ABSTRACT

The negative effect of oxygen on some metal films can be reduced or prevented by contacting the films with a treatment agent comprising silane or borane. In some embodiments, one or more films in an NMOS gate stack are contacted with a treatment agent comprising silane or borane during or after deposition.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present application relates generally to processes for providing aprotective treatment to metal thin films. In some embodiments, thinfilms used in metal gate and metal electrode applications in metal oxidesemiconductor field effect transistors (MOSFETs), such as n-channelMOSFETs (NMOS) are treated either during or after deposition in order toprevent or reduce the effects of oxidation.

2. Description of the Related Art

Oxidation of a metal thin film can easily occur during many steps inprocessing, such as by exposure to atmospheric water or oxygen. In amulti-step fabrication process oxidation may occur between thedeposition of each thin film, such as when transferring a wafer orsubstrate between deposition modules. Oxidation poses a problem in thatit can affect the workfunction of a given thin film or an entire stack.And oxidation in one thin film may lead to oxidation of the interfacebetween that film and a second film or even oxidation of the second filmitself if the oxygen is able to diffuse through the first film to thesecond film.

For example, in a typical fabrication process of a MOSFET, oxidation ofthe etch-stop layer can easily occur after formation of a PMOS stack andbefore formation of an NMOS stack. Oxidation of the etch-stop layer canaffect the workfunction of the subsequently formed NMOS stack, as it maylead to a shift in the workfunction, for example, from n-type to p-type.Other layers deposited during formation of a gate stack can also beexposed to oxygen, for example between deposition of each of the variousthin films.

Referring to FIG. 1, a typical NMOS stack 100 is illustrated. The stack100 includes a dielectric layer 102, a first metal nitride layer 104, ametal carbide layer 106—in which the interface 108 between the firstmetal nitride layer 104 and the metal carbide layer 106 includesoxidized portions represented by the presence of oxygen (“O”) atoms—asecond metal nitride layer 110, and a metal layer 112. The presence ofoxygen at the interface 108 between the first metal nitride layer 104and the metal carbide layer 106 can undesirably shift the workfunctionof the stack 100 from n-type to p-type.

Oxidation of the various layers can occur in a variety of ways duringformation of the stack; however, it is common for the first metalnitride layer 104 to have already been oxidized prior to the depositionof the metal carbide layer 106. Even if the metal carbide layer 106 isable to be deposited without the presence of oxygen so as to achieve arelatively pure layer of a metal carbide, oxygen present in the firstmetal nitride layer 104 is capable of diffusing up into the metalcarbide layer 106. Oxygen in the metal carbide layer 106 andparticularly at the interface 108 can undesirably shift the workfunction of the overall stack 100.

SUMMARY OF THE INVENTION

According to some embodiments of the present disclosure, methods forforming a gate stack include providing a substrate having a dielectricmaterial and a first metal-containing thin film over the dielectricmaterial, contacting the first thin film with a silane or boranecompound, and depositing a second metal-containing thin film over thefirst metal-containing thin film. In some embodiments, the first thinfilm comprises a metal selected from Ti, Ta, Hf, V, Nb, and Zr. In someembodiments, the first metal-containing thin film is an etch stop layeror barrier layer and the second metal-containing thin film is aworkfunction setting layer. The first metal-containing thin film in someembodiments is a TiN, TiAlN, TaN or TiAlCN thin film.

According to some embodiments, the second metal containing thin filmcomprises an n-type metal. And in some embodiments, the n-type metal (orn-metal) film comprises a metal carbide, such as TaC, TiC, HfC, TaAlC,TiAlSiC, or SiAlSiC. In some embodiments, the n-type metal is TiAl,TiAlB, TaAlB, TiAlSiB, TaAl, or HfAlSiB. The second metal-containingthin film in some embodiments is a titanium carbide film. In someembodiments the metal in the first metal-containing thin film isdifferent from the metal in the second metal-containing thin film.

According to some embodiments of a method for forming a gate stack,contacting the first metal-containing thin film with a silane or boranecompound comprises exposing the first metal-containing thin film to thesilane or borane compound for a duration of between about 1 second andabout 2 minutes. Some methods further include contacting the secondmetal-containing thin film with a silane or borane compound. In somemethods, depositing the second metal-containing thin film comprises anatomic layer deposition process comprising multiple deposition cycles.

According to some embodiments, the substrate is exposed to a silane orborane compound in each deposition cycle. Some methods further includedepositing a third metal-containing thin film over the secondmetal-containing thin film. The third metal-containing thin film maycomprise a different metal from the second-metal containing thing film.In some methods, the substrate is contacted with a silane or boranecompound during or after depositing the second metal-containing thinfilm and prior to depositing the third metal-containing thin film. Andin some methods, the substrate is contacted with a silane or boranecompound during or after deposition of the third metal-containing thinfilm. Some methods further include depositing a metal over the thirdmetal-containing thin film. The metal in some embodiments is tungsten.

According to some embodiments, the silane or borane is selected from thegroup consisting of monosilane, disilane, trisilane, borane, diborane,and triborane. And in some embodiments, the silane or borane istrisilane. According to some methods, the first and secondmetal-containing thin films are deposited in situ.

Some embodiments of methods for forming an NMOS stack according to thepresent disclosure include, sequentially, providing a substratecomprising a previously deposited dielectric material and an etch stoplayer, contacting the etch stop layer with a silane or borane compound;and depositing a metal-containing layer over the first etch stop layer.

In some methods, the etch stop layer is a titanium nitride layer and themetal-containing layer comprises an n-type metal. The metal-containinglayer in some methods comprises TiAl, TaC, HfC, TaAlC, TiAlSiC, TiAl B,TaAlB, TiAlSiB, TaAl, TiAlSiC TaAlSiB, or HfAlSiB. Some methods alsoinclude contacting the metal-containing layer with a silane or boranecompound. The metal-containing layer in some methods is deposited by anatomic layer deposition process comprising multiple deposition cycles,and the substrate is contacted with a silane or borane compound duringat least one of the deposition cycles. In some embodiments, the silaneor borane is selected from the group consisting of monosilane, disilane,trisilane, borane, diborane, and triborane. And contacting the etch stoplayer with a silane or borane compound in some methods does not increasethe thickness first metal nitride layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be better understood from the Detailed Description ofthe Preferred Embodiments and from the appended drawings, which aremeant to illustrate and not to limit the invention, and wherein:

FIG. 1 is a schematic cross-sectional side view of a gate stackcontaining an oxidized portion;

FIG. 2 is a schematic cross-sectional side view of an electrodestructure, comprising an NMOS stack that includes a dielectric layer, afirst metal nitride layer, a metal carbide layer, a second metal nitridelayer, and a metal layer, according to some embodiments of theinvention; and

FIGS. 3A-C are flow charts generally illustrating protective treatmentof a dielectric layer or titanium nitride layer during a process offorming a thin film stack, in accordance with some embodiments.

FIGS. 4A-C are flow charts generally illustrating protective treatmentof a titanium nitride or titanium carbide layer during a process offorming a thing film stack, in accordance with some embodiments.

FIG. 5 is a flow chart illustrating methods of forming a thin film byALD, in which supply of a protective treatment follows removal of excesssecond reactant and by-products, in accordance with some embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present disclosure provides methods for reducing or preventingundesirable effects of oxidation in one or more thin films comprisingmetal. The thin films can be deposited using known vapor depositionprocesses, such as atomic layer deposition (ALD) or chemical vapordeposition (CVD) processes. In some embodiments the methods for reducingoxidation can comprise an oxygen barrier material or a preventativetreatment applied to a deposited thin film. In some embodiments however,a protective treatment may be provided as a part of an ALD or CVD methodused to form the thin film. A protective treatment may comprise exposingthe film to be treated to a silane or a borane compound. The treatmentmay reduce or substantially prevent oxidation of the thin film and thepossible buildup of oxygen at the interface of the thin film and anoverlying layer.

Oxidation resistance is important in many contexts. For example, in agate stack even a minor amount of oxygen in the stack could change thestack's electrical properties, namely eWF, making it unsuitable for itsintended purpose. Moreover, processing, including deposition of filmsand film stacks, without exposure to air or ambient moisture can becostly, difficult, and/or too complex. The application of a preventativetreatment during or after deposition of one film in a manufacturingprocess may not only reduce or prevent oxidation of that film but alsoof overlying films during subsequent processing steps. Thus, using aprotective treatment can simplify processing while also controllingcosts.

In addition, although described as preventative, the treatment may alsoreduce the deleterious effects of oxygen that is already present in afilm, such as from previous processing steps or transport. The materialused in the treatment may remove or isolate oxygen that may be presentin a thin film or on the surface of a thin film. In some embodiments,treatment of one thin film may benefit subsequent layers or films inthat the treatment may prevent oxygen from migrating up into thoselayers.

Without being held to any particular theory, the silicon or boronintroduced into a metal film during treatment with silane or boranereduces bonds between oxygen and the metal by formation of silicon oxideor boron oxide. The oxygen may be present in the film at the time oftreatment, or the film may subsequently be exposed to oxygen. Forexample, if an oxidized TiN film is treated with silane or borane, theTiON is reduced back to TiN. The presence of Si and/or B in a treatedmetal film can also act as a barrier to oxidation, such as duringsubsequent processing steps, by allowing the oxygen to preferentiallybond with the Si and/or B, relative to the metal of the metal film.

In some embodiments, a silane or borane treatment can be used to reducethe resistivity of a thin metal film, such as a titanium carbide film.

In some embodiments, a metal thin film is deposited and subsequentlyreceives a protective treatment, which may comprise exposure to a silaneor a borane. For example a metal thin film may be formed by a knowndeposition process, such as by a CVD process and then exposed to aborane or silane, such as trisilane or disilane.

In some embodiments, the protective treatment may be provided duringdeposition of the metal film, rather than, or in addition to, thetreatment being applied after deposition. That is, the treatment may beapplied intermittently during deposition. For example, a substrate maybe exposed to silane or borane intermittently in an atomic layerdeposition process for forming a metal thin film, such as a metalnitride or metal carbide thin film. In some embodiments the substrate isexposed to the silane or borane in each deposition cycle, after acertain number of deposition cycles, or after all the deposition cycleshave been completed.

In some embodiments the thin film that is treated comprises one or moremetals selected from the group consisting of Ti, Ta, W, In someembodiments the thin film that is treated comprises Ta, Ti, or W, suchas a TaN film, a TiC film, or a W film. In some embodiments the thinfilm that is treated comprises TiAl, TaC, HfC, TaAlC, TaAlB, TaAl, SiC,HfAlSiB, etc. In some embodiments the thin film comprises an n-typemetal, such as titanium. In some embodiments the thin film is depositedduring integrated circuit processing, such as during formation of a gatestack, as described in more detail below. Although generally describedherein with reference to films deposited during fabrication of NMOStransistors, the skilled artisan will recognize that the methodsdescribed herein can be used in other contexts where metal-containingfilms are or could be exposed to oxygen.

In some preferred embodiments, the treatment agent comprises one or moresilane or borane, or a mixture of silanes and boranes. The silane orborane may be selected from the following: borane, diborane, triborane,silane, monosilane, disilane, trisilane, or a mixture of two or more ofthese. The treatment agent may be provided as a brief pulse, such asduring one or more ALD cycles, or may be provided for longer periods oftime, such as when a previously deposited film is being treated. Thelength of time can be controlled to achieve the desired amount ofsilicon or boron in the thin film.

In some embodiments, the pressure within a reaction chamber during aprotective treatment is between about 0.1 torr and about 50 torr, thoughthe pressure can be between about 0.5 torr and about 5 torr.

In some embodiments, the temperature within a reaction chamber isbetween about 350° C. and about 450° C., though it can be between about380° C. and about 420° C. or, preferably, between about 390° C. andabout 420° C.

In some embodiments, the duration of exposure to the treatment agent maybe from about 1 second and to about 60 seconds or more. Longer periods,such as at least about 10 seconds, may be desired if treating a thickerfilm, such as where a completed film has already or previously beendeposited prior to a protective treatment. And shorter periods, such asabout 1, 2 or 3 seconds, may be desired when incorporating a treatmentstep into a deposition cycle. In some embodiments, treatment maycomprise exposure to the treatment agent for less than 1 second.

Gate Stack Applications

The processes disclosed herein may be applied in a variety of contextswhere protecting a layer from oxidation or reducing the effect of oxygenon the properties of an oxidized layer may be beneficial. Althoughprimarily illustrated in the context of the fabrication of NMOStransistors, which may include planar “replacement gate” devices as wellas multiple gate transistors, such as FinFETs, the skilled artisan willbe aware of other relevant contexts in which the disclosed methods couldbe utilized, such as metal electrodes for memory structures where ann-type metal is needed.

In the context of the present disclosure, a protective treatment refersto exposing a thin film comprising metal on a substrate to a treatmentagent comprising silane or borane. The treatment agent may react withoxygen that may be present on or in the thin film or with oxygen uponsubsequent exposure of the thin film to oxygen or oxidizing agents. Insome cases, at least some oxygen is bound to metal atoms in the thinfilm, and with exposure to the treatment agent comprising silane orborane the metal oxygen bonds are reduced by preferential formation ofsilicon oxide or boron oxide. The silane or borane agent may also bindoxygen that is not bound to metal, such as oxygen that may be present inthe form of contaminants such as water, hydroxyl groups, etc.

As mentioned above, the treatment agent comprises one or more silanesand/or boranes, such as monosilane, disilane, trisilane, borane,diborane, and triborane.

The treatment agent may be applied in vapor or liquid form. However, thetreatment is typically carried out by providing a vapor phase pulse ofthe treatment agent The length of time that the treatment agent isapplied may vary, for example depending on the thickness of the filmbeing treated and the amount of oxidation or the anticipated exposure tooxidizing agents. In some embodiments the treatment agent is contactedwith the film for a period of about 1 second to about 10 minutes, fromabout 2 second to about 5 minutes, from about 10 seconds to about 2minutes or from about 20 seconds to about 60 seconds. However, shorteror longer exposures can be utilized. For example, in some embodimentsthe treatment agent may be applied as a relatively short pulse, such asless than about 1 second. In some embodiments a partially or completelydeposited film is soaked in the treatment agent, such as for 1 second ormore, 10 seconds or more, 20 seconds or more, 30 seconds or more, or 60seconds or more. In some embodiments the soak may be for at least oneminute, two minutes, five minutes, ten minutes or more. Specifictreatment times can be determined by the skilled artisan depending onthe particular circumstances such as the type of film, thickness of thefilm, amount of existing oxidation of the film and the type of exposureto oxidizing agents that is anticipated.

In some embodiments the protective treatment does not add to thethickness of a thin film, such that a thin film (or plurality of thinfilms) that has received a protective treatment is not appreciablythicker than a thin film that has not received such a treatment.

In some embodiments, a thin film comprising a metal is depositedaccording to a known process, such an ALD or a CVD process. A protectivetreatment can then be applied to the thin film after the thin film hasbeen fully deposited. However, in some embodiments, the protectivetreatment forms a part of the deposition process. For example, where anALD process is used, the protective treatment may comprise one step ofat least one ALD cycle. In some cases, the protective treatment isprovided in a certain number of ALD cycles or all of the ALD cycles. Forexample, the protective treatment may be provided as a separate pulse inevery ALD cycle, or provided every 2, 3, 4, 5, 10, 20 or more ALDcycles. For CVD deposition, the CVD deposition process may beinterrupted one or more times during deposition to provide the treatmentagent. In some embodiments, the protective treatment is applied as thelast pulse or exposure in the deposition process.

In some embodiments, the protective treatment is applied to thesubstrate prior to the deposition of a thin film that is to be protectedfrom oxidation. For example, treatment of an oxidized film on asubstrate surface may prevent migration of oxygen from that film to afilm that is subsequently deposited over the treated film and that willbenefit from being protected from oxidation.

As discussed above, in addition to reducing metal oxide and thusaddressing previous exposure to an oxidizing agent, the use of aprotective treatment may also protect a metal thin film from beingoxidized by subsequent exposure to oxygen. The use of a protectivetreatment may also at least partially protect one or more films that aredeposited over a treated thin film.

Referring to FIG. 2, an exemplary embodiment of an NMOS stack 200 isillustrated. The stack 200 includes a dielectric layer 202, such ashafnium oxide, a first etch stop layer or bottom barrier layer 204, suchas a titanium nitride (TiN) layer, a first n-type metal layer, hereillustrated as a metal carbide layer 206, such as tantalum carbide(TaC), a second metal nitride layer 208, and a metal layer 210, such asa tungsten (W) layer. The presence of silicon 212 derived from aprotective treatment is illustrated as being contained within the firstmetal nitride layer 204. While the silicon 212 may form a part of or becontained in any one of or more than one of the illustrated layers, FIG.2 illustrates that the silicon 212 is located more or less at theinterface of the first metal nitride layer 204 and the n-type metallayer 206. Without being tied to any particular theory, it is believedthat this interface or near-interface region may determine or influencethe workfunction of the overall stack 200. Thus, limiting the migrationof materials such as oxygen or aluminum—which can occur more easily asthe layers become thinner—may help protect the workfunction or anothercharacteristic of the stack 200. Accordingly, in some embodiments, suchas the one illustrated here, it may be particularly beneficial toprovide a protective treatment as a part of the deposition of the etchstop layer 204 or prior to the deposition of the n-metal layer 206,where the protective treatment may provide silicon 212 (or boron), atleast at or near the interface between the etch stop and n-metal films(the first metal nitride layer 204 and the metal carbide layer 206 asillustrated). In some embodiments, a protective treatment is applied tothe first etch stop layer 204 once the substrate has been placed in achamber for depositing the n-metal layer but before deposition of then-metal layer has begun. Of course, treatment may be utilized to provideSi or B at the interface between any two layers.

In some embodiments, an etch-stop layer (or bottom barrier layer) thatreceives a protective treatment could comprise TiN, TaN, or othermaterials known in the art. And materials other than TaC could be usedas then n-type metal layer, including other oxygen sensitive n-typemetal films, such as TiAl, TiC, HfC, TaAlC, TaAlB, TaAl, SiC, HfAlSiB.Other types of films that would benefit from the treatment will beapparent to the skilled artisan.

The use of a protective treatment can bind up at least some of theoxygen that may be present initially, or upon subsequent exposure, suchas during transport from one chamber to another. The use of a protectivetreatment may also reduce at least some of the previously oxidizedportions of a thin film, such as the first metal nitride layer 204. Forexample, substrates may be received that already contain an etch stoplayer (or bottom barrier layer), such as a TiN layer, and that layer canbe treated as described herein by exposure to a treatment agent prior tosubsequent processing.

The thicknesses of the various layers in the stack 200 may vary, thoughin some embodiments, such as the one illustrated in FIG. 2, the firstmetal nitride layer 204 may be from about 5 Å to about 20 Å thick, forexample about 15 Å thick, and the second metal nitride layer may beabout 30 Å to about 50 Å thick. The use of a protective treatment aspresently disclosed can have particular utility where the thicknesses ofthe various layers in a stack, such as stack 200, are reduced to achievesmaller electronic devices and circuitry.

The protective treatments disclosed herein could be applied to any oneor more of the layers 202, 204, 206, 208, or 210 before, during, orafter the deposition of each thin film. In some embodiments, it ispreferable to treat one or both of layers 204 and 206. In someembodiments, it may be preferable to treat one or more of layers 204,206, and 208. The use of a protective treatment before or during theformation of the NMOS workfunction setting layer (the n-metal layer 206as illustrated) has been mentioned; however a treatment agent could alsoor alternatively be applied before or during the deposition of the firstetch stop layer (the first metal nitride layer 204). In someembodiments, the use of a protective treatment on the first metalnitride layer 204 may eliminate or reduce the need for such a treatmentof any subsequent layers or at least the NMOS workfunction setting layer206. Similarly, the use of a protective treatment before, during, orafter the formation of the n-metal layer 206 may eliminate or reduce theneed for a similar treatment to subsequent layers, particularly if atreatment applied to the n-metal layer 206 preserves the work functionof the overall stack 200 irrespective of moderate oxidation of thesubsequent layers 208 or 210.

However, in some embodiments, it may be beneficial to treat the secondmetal nitride layer 208 and/or the metal layer 210. As with the lowerlayers, a protective treatment may reduce oxidized portions of thoselayers, scavenge oxygen contaminates, and/or prevent subsequentoxidation when exposed to contaminates or the atmosphere.

Irrespective of the layer being discussed, the same methods for applyingthe protective treatment can be used. In some embodiments the treatmentagent is provided as a pulse as a part of a deposition cycle. In someembodiments a deposited film, or portion of a deposited film is soakedin the treatment agent. For example, a protective treatment could beincorporated into an ALD process for forming any one of the layers 204,206, 208, or 210. And the treatment agent could be provided in every ALDcycle or just in some cycles. With a CVD process, the treatment could beincorporated during the deposition process as other precursors are beingexposed to the substrate or could be provided after deposition of thefilm has been completed and all the precursors have reacted with thesubstrate and excess reactants have been purged from the reaction space.In some embodiments CVD may be used to deposit film to a firstthickness, CVD can be stopped and the reaction chamber purged, thatthickness can be exposed to a treatment agent, and CVD can be continuedto add additional thickness to the film. This can be repeated as manytimes as desired to obtain a film with the desired thickness. Again, afinal treatment can be applied after the final deposition.

With reference again to FIG. 2, in some embodiments a first metalnitride layer 204 is deposited over the dielectric layer 202, which maycomprise a dielectric material such as hafnium oxide. A protectivetreatment may be applied before, during, and/or after the deposition ofthe first metal nitride layer 204. In some embodiments, it is desirableto apply a protective treatment to a completed first etch stop layer,such as a TiN layer, prior to the deposition of the NMOS workfunctionsetting layer, such as then-metal layer 206, even if a protectivetreatment was used in the deposition of the first etch stop layer. Forexample, if some time has passed from the time the first metal nitridelayer 204 was deposited and the time when the n-metal layer 206 isdeposited. Such a delay may increase the chances that the first metalnitride layer will be exposed to water, air, etc.

FIG. 3A illustrates one possible process where a substrate having adielectric material is provided at step 302, and a metal nitride layer,such as a titanium nitride etch stop layer, is deposited over thedielectric layer at step 304. A protective treatment is then applied tothe completed titanium nitride etch stop layer at step 306. Theprotective treatment applied at step 306 may be applied as a soak, andmay reduce TiON and/or bind to free oxygen in the TiN layer,particularly near the surface. The duration of step 306 may be, forexample, from about 30 seconds to about 4 minutes. The duration maydepend on the thickness of the titanium nitride layer and may beadjusted by the skilled artisan based on the particular circumstances.In some embodiments, the duration can be shortened if step 306 isperformed at a higher pressure and/or a higher temperature.

FIG. 3B illustrates a process where a substrate having a dielectricmaterial is provided at step 312, and a protective treatment is appliedto the dielectric layer at step 314. A titanium nitride is thendeposited by a known method at step 316. In this process, free oxygenthat may have been present in or on the dielectric layer may be bound upby the protective treatment so that it is not available to oxidize thetitanium deposited in step 316. In some embodiments where the dielectricmaterial receives a protective treatment, the protective treatment maynot prevent subsequent oxidation of additional layers, but it mayprevent oxygen in the dielectric from diffusing up into the additionallayers.

FIG. 3C illustrates one process where a substrate having a dielectricmaterial is provided at step 322, and a titanium nitride film isdeposited by an ALD method at step 324 in which a protective treatmentis incorporated into one or more of the deposition cycles. Theprotective treatment may be provided in only one deposition cycle or maycomprise a step in a certain number of cycles, such as every other cycleor every third, fourth, fifth, sixth, seventh cycle, etc.

In some embodiments, the deposition of the titanium nitride layer atstep 324 may comprise an ALD process having the following steps:

-   -   1. providing a titanium precursor, such as a titanium halide, to        the reaction space;    -   2. substantially purging and/or evacuating excess titanium        precursor and reaction byproducts;    -   3. providing a nitrogen-contributing reactant to the reaction        space, such as NH₃, hydrazine, or radicals/ions of N and H (such        as in a PEALD process);    -   4. substantially purging and/or evacuating excess        nitrogen-contributing reactant and reaction byproducts; and    -   5. providing a protective treatment agent comprising a silane or        borane, to the reaction space.

Step 5 can be included in each ALD cycle or only some of the ALD cycles.Thus, steps 1-4 can be repeated several times before step 5 isintroduced. Step 5 may also be used prior to any ALD cycle or only asthe first step in the first ALD cycle.

Again referring to FIG. 2, the n-metal carbide layer 206 can bedeposited over the first metal nitride layer 204. A protective treatmentmay be applied before, during, and/or after the deposition of then-metal layer 206. FIG. 4A illustrates one possible process where atitanium nitride layer is provided at step 402, and an n-type metallayer, such as a titanium carbide layer, is deposited over the titaniumnitride layer at step 404. A protective treatment is then applied to thecompleted titanium carbide layer at step 406. In some embodiments,application of a protective treatment during or before the deposition ofthe work function setting n-metal layer 206 may help minimize thepresence of oxygen in the film while the n-metal layer 206 awaits thesecond metal nitride layer 208 in a clustered or declustered process.The protective treatment applied at step 406 may comprise soaking thedeposited titanium carbide layer in a treatment agent comprising silaneor borane. The protective treatment may reduce or bind to oxygencontaminates in the TiC film.

FIG. 4B illustrates one process where a titanium nitride layer isprovided at step 412, and a protective treatment is applied to thetitanium nitride layer at step 414. A titanium carbide is then depositedby a known method at step 416. In this process, free oxygen that mayhave been present in or on the titanium nitride layer may be bound up bythe protective treatment agent so as to prevent or reduce oxidation ofthe titanium carbide deposited in step 416.

Other materials may also benefit from the application of a protectivetreatment according to the present disclosure. All NMOS workfunctionlayers, such as pure metals like Al and Ti, or transition metalnitrides, carbides, borides, silicides, etc. may suffer from oxygenincorporation making them more p-type. Accordingly, a protectivetreatment could be applied to films comprising any of such materials.

FIG. 4C illustrates one process where a titanium nitride is provided atstep 422, and a titanium carbide is deposited by an ALD method at step424 in which a protective treatment is incorporated into one or more ofthe deposition cycles. For example, the protective treatment maycomprise a step in only one cycle or may comprise a step in a certainnumber of cycles, such as every other cycle or every third, fourth,fifth, sixth, seventh cycle, etc.

In some embodiments, the deposition of the titanium carbide layer atstep 424 may comprise an ALD process having the following steps:

-   -   1. providing a titanium precursor, such as a titanium halide (or        other transition metal halides), to the reaction space;    -   2. substantially purging and/or evacuating excess titanium        precursor and reaction byproducts;    -   3. providing a carbon-contributing reactant to the reaction        space, such as compounds containing metal-carbon bonds including        metalalkyl compounds (e.g., TTBA and TMA);    -   4. substantially purging and/or evacuating excess        carbon-contributing reactant and reaction byproducts; and    -   5. providing a protective treatment agent comprising a silane or        borane, to the reaction space.

Step 5 can be included in each ALD cycle or only in some of the ALDcycles. Thus in some embodiments steps 1-4 can be repeated several timesbefore step 5 is introduced. Step 5 may also be used prior to any ALDcycle or only as the first step in the first ALD cycle. Application of aprotective treatment prior to any ALD cycle for depositing the n-metallayer 206 may be desirable where the first metal nitride layer 204 hasalready been oxidized, such as where the first metal nitride layer hasserved as an etch-stop layer in a prior process. In such cases, it maybe desirable to apply the protective treatment as a soak of a treatmentagent comprising silane or borane prior to depositing the n-metal layer206. In some embodiments where the TiN layer 204 is treated, protectivetreatment during or after the deposition of the n-metal layer 206 is notutilized. However, in some embodiments where the first metal nitridelayer 204 has been treated, it may still be desirable to apply aprotective treatment during or after the deposition of the n-metalcarbide layer 206.

In some embodiments, NMOS stacks containing n-metal thin filmsfabricated using the methods disclosed herein exhibit a leakage (J_(g))(at −1V stress,) of less than about 10⁻² A/cm², less than about 10⁻³A/cm², or less than about 3*10⁻⁴ A/cm².

In some embodiments of the present disclosure, n-metal thin films can beformed in which the equivalent oxide thickness, or EOT, of the thinfilms can be less than about 1.3 nm, less than about 1.2 nm, preferablyless than about 1.1 nm, or less than about 1.05 nm.

In some embodiments of the present disclosure, n-metal films can beformed in which the effective workfunction, or eWF, can be from about4.0 to about 4.4 eV, from about 4.05 to about 4.35 eV, or from about 4.1to about 4.25 eV.

In some embodiments, the use of a protective treatment such as a silane(e.g., disilane or trisilane) can reduce the resistivity of an n-metalthin film relative to a TiC film to which a protective treatment is notexposed. In some embodiments, the resistivity is reduced up to or asmuch as about 30%, up to or as much as about 40%, or up to or as much asabout 50%. In some embodiments, such as where a protective treatment isapplied as soak after deposition, resistivity reduction may be as muchas about 5%, as much as about 10%, or as much as about 20%.

Again referring to FIG. 2, a metal layer 210 may be deposited by anyknown method. A protective treatment may be applied before, during,and/or after deposition of the metal layer 210. In some embodiments, asecond metal nitride layer 208 is provided, and the metal layer 210 isdeposited over the metal nitride layer 208. The second metal nitridelayer 208 can be deposited over the n-metal layer 206. A protectivetreatment may be applied before, during, and/or after the deposition ofthe second metal nitride layer 208, similar to the first metal nitridelayer 212. In this process, free oxygen that may have been present in oron the second metal nitride layer 208 may be bound up by the protectivetreatment so as to not oxidize the subsequently deposited tungsten.Reducing the amount of free oxygen in the second metal nitride layer 208may have the added benefit of diminishing the amount of oxygen thatcould diffuse down into the stack 200 during subsequent processes, suchas downstream thermal processing, diffusion that could actually reachthe workfunction layer (i.e., the n-metal layer 206 or another suitablelayer such as TaC).

A protective treatment may be applied to the completed metal layer 210.The protective treatment may be applied as a soak to the deposited metalfilm. In some embodiments, a metal layer is deposited by an ALD methodin which a protective treatment is incorporated into one or more of thedeposition cycles. For example, the protective treatment may comprise astep in only one deposition cycle or may comprise a step in a certainnumber of cycles, such as every fifth, tenth, twentieth cycle, etc.

Again, while illustrated in the context of treating thin films in anNMOS stack, other metal-containing films can be treated as well. Theexact composition of metal thin films produced and/or treated using themethods and materials disclosed herein may vary. For example, titaniumcarbide films fabricated according to the present disclosure may containa number of differing elemental components including, but not limited totitanium, aluminum, carbon, silicon and/or boron depending in part onthe type of protective treatment used.

In some embodiments, the atomic percentage of silane or borane presentin a film after treatment could be greater than about 10%, greater thanabout 25%, or greater than about 35%. In embodiments where theprotective treatment is applied as soak, the silane or borane may bevery concentrated at those surfaces that were treated, with theconcentration dropping off rapidly below those surfaces. In embodimentswhere the protective treatment is applied as a part of a depositionprocess, such as in an ALD process, the silane or borane concentrationmay be from about 5% to about 50%.

Deposition Methods

As discussed above, in addition to the treatment of deposited films,methods presented herein allow treatment during deposition of conformalmetal thin films on substrate surfaces.

According to some embodiments, an ALD or quasi-ALD process is used inwhich a material, such as silicon or boron, is incorporated into a metalthin film and protects the film from oxidation. In some embodiments, theprotective treatment is incorporated into one or more cycles of thedeposition process. In some embodiments, the protective treatment isapplied to a metal thin film after all the deposition cycles have beencompleted. In some embodiments, the protective treatment is appliedprior to a deposition process in order to prepare an underlying surfaceor as the first step in a deposition process.

According to some embodiments, an ALD or quasi-ALD process is used toform a metal film. For example, one or more films in an NMOS stack canbe formed. An exemplary NMOS stack may comprise a dielectric layer, suchas a hafnium oxide (HfO₂) layer, a thin layer of a firstmetal-containing film, such as a metal nitride, for example titaniumnitride (TiN), over the dielectric, a second metal-containing film, suchas a carbide, for example titanium carbide (TiC), over the firstmetal-containing film, a third metal-containing film, such as a metalnitride, for example TiN, over the second metal-containing film, and alayer of metal, such as tungsten, over the third metal-containing film.In some embodiments, one or more additional elements may be present inone or more of these layers. For example, one or more layers may furthercomprise silicon or boron, such as following treatment.

In some embodiments an NMOS stack comprises a dielectric layer, a firstmetal nitride layer over the dielectric layer, a metal carbide layerover the first metal nitride layer, a second metal nitride layer overthe metal carbide layer, and a metal layer over the second metal nitridelayer. In some embodiments each of the overlying layers is depositeddirectly on and contacting the underlying layer.

In some embodiments an NMOS stack comprises a dielectric layer, such asHfO₂, a first titanium nitride layer over the dielectric, a titaniumcarbide layer over the first titanium nitride layer, a second titaniumnitride layer over the titanium carbide layer, and a tungsten layer overthe second titanium nitride layer.

A protective treatment may be used in the deposition process of one ormore of these respective thin films of the NMOS stack. In someembodiments, a protective treatment is used prior to the deposition ofone or more thin films. In some embodiments, a protective treatment isused after the deposition of one or more thin films. Of course othermetal films may be deposited by ALD or quasi-ALD processes comprisingone or more treatment steps.

In some embodiments, the protective treatment does not increase thethickness of the thin film. This is particularly beneficial as thinnerand thinner films become more and more desirable and necessary, as oneproblem with thinner films is that oxygen can more easily diffusethrough and oxidize them as compared to thicker films in which only theupper portions would be oxidized. It will be readily appreciated bythose of skill in the art, that protective treatments can providebenefits to many different functional thin films.

According to some embodiments of the present disclosure, the use of aprotective treatment in the fabrication of multiple thin films, such asto form an NMOS stack, can result in a lower resistivity of the films—asmuch as about 30% less—compared to films fabricated without the use of aprotective treatment. In some embodiments, the presence of silicon orboron—a component of the protective treatment—may serve to reduce theoverall resistivity of the film or films.

In some embodiments, the use a protective treatment may eliminate orreduce the need to utilize an in situ or clustered fabrication process.In some embodiments, the use of a protective treatment may allow forfabrication processes performed at lower vacuum than ordinary processes.However, in some embodiments, high vacuum, clustered, and/or in situprocesses are desirably combined with a protective treatment.

In some embodiments, some of the variables that can be controlled toachieve a desirable result include, but are not limited to, pressure,temperature, duration, and quantity of the protective treatment used. Insome embodiments, the pressure within a reaction chamber is betweenabout 0.1 torr and about 10 torr. In some embodiments, the pressure isbetween about 0.5 torr and about 5 torr. In some embodiments, thetemperature within a reaction chamber is between about 350° C. and about450° C. In some embodiments, the temperature is between about 380° C.and about 420° C. and, preferably, between about 390° C. and about 420°C.

According to some embodiments, the duration of a treatment, cycle step,pulse, or soak using a protective treatment is between about 1 secondand about 60 seconds. Longer periods, such as at least about 10 seconds,may be desired if treating a thicker film, such as where a completedfilm has already or previously been deposited prior to a treatment witha protective treatment. And shorter periods, such as about 2-3 secondsor less, may be desired when incorporating a treatment step into adeposition cycle, such as in the formation of a metal carbide or metalnitride layer. The duration of a treatment step may also depend on thereactor conditions. For example, where a reaction chamber tends to nothold pressure over time, it may be desirable to perform the treatment asa plurality of short pulses in order to maintain a relatively constantconcentration within the reaction. However, in a reactor that canmaintain pressure longer, longer single pulses or soaks may bedesirable.

Metal Carbide Films

According to some embodiments, an ALD type process is used to form metalthin films on a substrate. For example, metal carbide thin films, suchas titanium carbide can be deposited on an integrated circuitworkpieces. Other suitable metal carbide thin films include, but are notlimited to, TaC, HfC, TaAlC, SiC, etc. The ALD process may comprise atleast one deposition cycle in which a treatment agent comprising silaneand or borane is provided. The surfaces on which the thin titaniumcarbide (TiC) films are deposited can take a variety of forms. Examplesinclude, but are not limited to silicon, silicon oxide (SiO₂), coatedsilicon, dielectric materials, low-k materials, metals—such as copperand aluminum—metal alloys, metal oxides and various nitrides, such astransition metal nitrides and silicon nitride or a combination of saidmaterials.

In a some embodiments, a substrate or workpiece is placed in a reactionchamber and subjected to alternately repeated surface reactions. Inparticular, thin films are formed by repetition of an ALD cycle. EachALD cycle is typically self-limiting. In the case of compound metallicthin film deposition, at least two different source chemicals arealternatively employed. One reactant will form no more than about onemonolayer on the substrate surface and includes a metal species desiredin the layer being deposited. This reactant, also referred to herein as“the metal reactant,” is preferably a titanium halide, and thus thedeposited monolayer is terminated with halogen ligands.

A second reactant preferably contributes carbon. In some embodiments,the second reactant comprises a metal and carbon, such astrimethylaluminum (TMA) or triethylaluminum (TEA). In some embodiments,the second reactant is a metal-containing source chemical comprising atleast one ligand, such as a metalorganic compound. Further, in someembodiments the second reactant can also leave some amount of metal inthe film being deposited. For example, in the case of TMA or TEA, someamount of aluminum may be left in the film, depending on the particularreaction conditions.

In some embodiments according to the present disclosure, a thirdreactant that is the protective treatment agent is provided every cycle,after a certain number of cycles, or after deposition of the metalcarbide film is complete. The third reactant may comprise a siliconcompound, such as a silane, or a boron compound, such as a borane. Theprotective treatment agent is preferably more reactive to oxygen than istitanium and thus is capable of reducing the amount of titanium oxide inthe film. In some cases, little or no oxygen is actually removed fromthe thin film; however, the protective treatment acts to reduce titaniumoxide by breaking the bonds between titanium and oxygen to return thetitanium to its pure titanium carbide form. In such cases, although, theoxygen has not actually been removed from the film, it is bound up bythe protective treatment so as to not impede the workfunction of thethin film. Accordingly, it could also be said that application of aprotective treatment increases the amount of TiC compared to the amountof TiOC in the film. Moreover, in some embodiments the third reactantalso provides a species desired in the thin film, such as silicon orboron.

The protective treatment agent may be selected from the group consistingof monosilane, disilane, trisilane, borane, diborane, triborane, or anyother suitable material that readily reacts with oxygen to reducetitanium. The protective treatment may be supplied in vapor or liquidform, and may be applied as a relatively short pulse every cycle orintermittently in the deposition process or as a relatively longer soakto a partially or completely formed titanium carbide layer.

The protective treatment may be provided before one or more ALD cycles,in each ALD cycle, at intervals during the deposition process, or afterthe deposition process has been completed. For example, in someembodiments the protective treatment is provided every one to four ALDcycles. In some embodiments, at the time the protective treatment isprovided, the film grown in the most recent ALD cycles is preferablythin enough that the protective treatment can penetrate the film. Insome embodiments, such as situations where more than one depositioncycle has been completed prior to exposure to the protective treatment,the amount of silane/borane penetration in the films can be controlledby the quantity or concentration of the agent used or the duration ofthe exposure.

The protective treatment may be provided as a part of one or more cyclesor may be applied after one or more cycles have been completed. Thus, insome embodiments, the deposition of a metal carbide film, such as TiC,is considered to be a cycle in an ALD process independent of theapplication of a protective treatment. In such cases, the cycle isrepeated as many times as desired, and the silane/borane treatment isapplied after some or all of the cycles. However, in some embodiments,the protective treatment is applied during one or more cycles (as a partof an ALD cycle) as well as after one or more cycles (separate from anALD cycle).

In one phase of an ALD cycle (“the titanium phase” or the “firstphase”), the reactant or source chemical comprising titanium is suppliedto the reaction chamber and chemisorbs to the substrate surface. Thereactant supplied in this phase is selected such that, under thepreferred conditions, the amount of reactant that can be bound to thesurface is determined by the number of available binding sites and bythe physical size of the chemisorbed species (including ligands). Thechemisorbed layer left by a pulse of the titanium reactant isself-terminated with a surface that is non-reactive with the remainingchemistry of that pulse. This phenomenon is referred to herein as“self-saturation.” One of skill in the art will recognize that theself-limiting nature of this phase makes the entire ALD cycleself-limiting. Excess reactant and reactant byproducts (if any) areremoved from the reaction space, for example by purging with an inertgas and/or evacuation.

In the next phase of the cycle, a pulse of a second source chemical isprovided that reacts with the molecules left on the substrate surface bythe preceding pulse. In some embodiments the source chemical preferablycomprises carbon that is to be incorporated in the thin film. The carbonis incorporated into the thin film by the interaction of the sourcechemical with the monolayer left by the metal reactant. This phase isreferred to herein as “the second phase” or the “carbon-contributingphase.” In some embodiments, the second source chemical is a carboncontaining compound and its reaction with the chemisorbed metal speciesproduces a metal carbide layer on the substrate. In some embodiments thesecond source chemical also comprises a second metal, such as aluminum,and the second metal is incorporated into the growing film along withthe carbon. In some embodiments the species-contributing source chemicalcomprises metal and carbon and may be, for example, TTBA, TMA, or TEA.The second source chemical may or may not be self-limiting whendeposited on the substrate.

Excess second source chemical and reaction byproducts, if any, areremoved from the reaction space by purging and/or evacuation.

In some embodiments, a third phase of the ALD cycle comprises providingthe protective treatment. In the some embodiments the protectivetreatment removes oxygen from the growing thin film and/or reacts withoxygen preferentially relative to the other metals in the growing film.In some embodiments, the protective treatment may also remove or isolateother contaminants. In addition, the protective treatment may comprise aspecies that may be incorporated into the thin film, such as boron orsilicon. This is referred to as the “third phase” or the “oxygenisolation phase.”

Although referred to as the “first phase,” the “second phase” and the“third phase,” these labels are for convenience and do not indicate theactual order of the phases in each ALD cycle. Thus, the initial ALDcycle may be started with any of the three phases described above.However, one of skill in the art will recognize that if the initial ALDcycle does not begin with the metal reactant phase, at least two ALDcycles will typically need to be completed to deposit about a monolayerof the desired metal carbide thin film.

In addition, the order of the phases may be changed. That is, in someembodiments the protective treatment may be the next reactant providedafter the second reactant, while in other embodiments the protectivetreatment may be the next reactant provided after the first metal sourcereactant. And in some embodiments, the protective treatment may besupplied after only some cycles or after all cycles have been completed.For example, in some embodiments the third phase (provision of theprotective treatment) may immediately follow the first phase (provisionof the reactant comprising a metal species), which in turn is followedby the carbon-contributing phase. And in some embodiments, the thirdphase may be supplied as a “soak,” liquid or vapor, after the thin filmhas been completely formed. That is, the deposited film is exposed to asilane or a borane in liquid or vapor form for a period of time. A phaseis generally considered to immediately follow another phase if only apurge or other reactant removal step intervenes.

In some embodiments the protective treatment is not provided in everyALD cycle. Rather, a partially or completely deposited titanium carbidefilm may be treated with a protective treatment agent. This may thecase, for example, where a first film has been formed using TiCl₄ andTEA but the resulting TiAlC film has been oxidized by water, air, orsome other contaminant source to form a layer that is essentiallyTiAlOC. A protective treatment can be applied to the first film toreduce the TiAlOC layer back to essentially TiAlC with only the minorpresence of impurities.

In one embodiment, an ALD cycle comprises:

-   -   1. providing a titanium halide to the reaction space;    -   2. substantial purging and/or evacuation of excess titanium        halide and reaction byproducts;    -   3. providing a carbon-contributing reactant to the reaction        space, such TEA or TMA;    -   4. substantially purging and/or evacuation of excess second        reactant and reaction byproducts; and    -   5. providing a protective treatment to the reaction space.

Step 5 can be included in each ALD cycle, or steps 1-4 can be repeatedseveral times before step 5 is introduced. In some embodiments steps 1-4are repeated up to 10 times before step 5 is included. In otherembodiments steps 1-4 are repeated up to 100 or even 1000 or more timesbefore step 5 is included. In some embodiments, a complete film ofdesired thickness is deposited prior to step 5.

With reference to FIG. 5, in an embodiment of the invention, afterinitial surface termination, if necessary, a first reactant or sourcechemical pulse is supplied 502 to the substrate or workpiece. In theillustrated embodiment, the first reactant is a metal halide, and thethin film being formed comprises a metal carbide. In accordance with apreferred embodiment, the first reactant pulse comprises a carrier gasflow and a volatile titanium halide species that is reactive with theworkpiece surfaces of interest. Accordingly, the halogen-containingtitanium species adsorbs upon the workpiece surfaces. The first reactantpulse self-saturates the workpiece surfaces such that any excessconstituents of the first reactant pulse do not further react with themonolayer formed by this process. Self-saturation results due to halidetails terminating the monolayer, protecting the layer from furtherreaction.

The first reactant is then removed 504 from the reaction space. Step 504may entail merely stopping the flow of the first reactant or chemistrywhile continuing to flow a carrier gas for a sufficient time to diffuseor purge excess reactants and reactant by-products from the reactionspace. Preferably the removal 504 comprises continuing to flow purge gasfor between about 0.1 seconds and 20 seconds after stopping the flow ofthe first reactant pulse. Inter-pulse purging is described in co-pendingU.S. Pat. No. 6,511,539, entitled “IMPROVED APPARATUS AND METHOD FORGROWTH OF A THIN FILM,” the disclosure of which is incorporated hereinby reference. In other arrangements, the chamber may be pumped downbetween alternating chemistries. See, for example, PCT publicationnumber WO 96/17107, published Jun. 6, 1996, entitled “METHOD ANDAPPARATUS FOR GROWING THIN FILMS,” the disclosure of which isincorporated herein by reference. Together, the adsorption 502 andreactant removal 504 represent a first phase 505 in an ALD cycle. Thefirst phase in the illustrated ALD cycle is thus the metal phase.

With continued reference to FIG. 5, a second reactant or source chemicalpulse is then supplied 506 to the workpiece. The second chemical reactswith the monolayer left by the first reactant. In the illustratedembodiment, this second reactant pulse 506 comprises supplying a carriergas with the second source gas to the workpiece. In particular, wherethe first reactant comprises a titanium halide, the second reactant,such as TMA or TEA, comprises carbon and a second, different metal. Inthe case of TEA or TMA the second reactant leaves no more than about amonolayer of TiCAl. The second reactant preferably removes at least somehalide ligands from the adsorbed first reactant. The second reactantpulse 506 also leaves a surface termination that operates to limit thedeposition in a saturative reaction phase.

After a time period sufficient to completely saturate and react themonolayer with the second reactant pulse 506, any excess second reactantis removed 508 from the workpiece. As with the removal 504 of the firstreactant, this step 508 may comprise stopping the flow of the secondchemistry and continuing to flow carrier gas for a time periodsufficient for excess reactants and volatile reaction by-products fromthe second reactant pulse to diffuse out of and be purged from thereaction space. Together, the second reactant pulse 506 and removal 508represent a second phase 509 in the illustrated process, and can also beconsidered a carbon and metal species-contributing phase.

When the excess reactants of the second reactant pulse have been removed508 from the chamber, a third reactant or source chemical pulse may besupplied to the workpiece 510. The third reactant can be a protectivetreatment agent or oxygen barrier material capable of removing halidesand/or reacting with oxygen in the growing film. Examples of suitableagents include silanes and boranes, including monosilane, disilane,trisilane, borane, and diborane. The oxygen barrier material orprotective treatment may be provided with an inert carrier gas.Temperature and pressure conditions can be adjusted to control the levelof diffusion of the protective treatment through the monolayer.

After a time period sufficient to achieve a desired level of saturationof the third reactant in the monolayer, excess unreacted oxygen barriermaterial and any reaction by-products (which may also be volatile) areremoved 512 from the reaction space, for example by a purge gas pulse.The removal can be as described for step 204. Together, the protectivetreatment pulse 510 and removal 512 represent a third phase 513 of theillustrated ALD process, which can also be referred to as the oxygenisolation phase.

The combination of first phase 505, second phase 509, and third phase513, can be considered as a single deposition cycle 515. In someembodiments, the ordering of the third phase 513 actually precedeseither or both the first phase 505 and the second phase 509. In someembodiments, the third phase 513 is included in only some or only onedeposition cycle 515.

In some embodiments, supplying a protective treatment immediatelyfollows the step of removing excess first reactant and by-products.After a time period sufficient to react the monolayer with theprotective treatment, excess unreacted protective treatment materialsand reaction by-products are removed from the reaction space, possiblyby a purge gas pulse. The removal step is followed by supply of thesecond reactant pulse.

In some embodiments of the disclosure (not shown), the steps ofsupplying the protective treatment and removing any excess protectivetreatment materials and by-products precede the step of supplying thefirst reactant. In some embodiments, the protective treatment is notprovided in every cycle or may be provided after all the cycles arecomplete.

In some embodiments, the step of supplying a protective treatment takesthe form of a soak occurring after some or all of the titanium carbidedeposition cycles have been completed. In some cases, a soak oftrisilane occurring after deposition of a TiC film is completed has beenfound to achieve suitable results.

In one embodiment, a process for forming a titanium carbide filmcomprises:

-   -   1. providing a titanium halide, such as a titanium chloride, to        the reaction space;    -   2. substantially purging and/or evacuation of excess titanium        halide and reaction byproducts;    -   3. providing a second carbon and aluminum-contributing reactant,        such as TEA or TMA, to the reaction space;    -   4. substantially purging and/or evacuation of excess second        reactant and reaction byproducts;    -   5. repeating steps 1 through 4 for either a desired number of        cycles or until a film of a desired thickness has been achieved;        and    -   6. subjecting the product of step 5 to a soak with a protective        treatment agent.

The soak of Step 6 can be configured to achieve a particular level ofinteraction between any oxygen present in the film and the protectivetreatment. For example, the soak may last long enough to substantiallydiffuse throughout the film or the soak's duration may be kept shorterso as to reach only a partial depth in the film. In some embodiments, asoak may serve to “coat” a thin film with an oxygen barrier by providingsilicon or boron in the film. In some embodiments, the protectivetreatment is applied as a soak is trisilane.

The foregoing embodiments will be discussed in the context of specificthin film chemistries.

Carbon containing metal films or metal carbides have varyingapplications, such as gate electrodes, electrodes in capacitors andbarrier layers in damascene and dual damascene structures.

In some embodiments, a general pulsing sequence for carbon-containingmetal or metal carbide thin film deposition is:

(M¹X_(y)+purge+M²R₃+purge+protective treatment+purge)×m₁

or

(M¹X_(y)+purge+protective treatment+purge+M²R₃+purge)×m₁,

wherein m₁ is the number of total cycles.

M¹ is a metal atom, preferably selected from the group consisting of Ti,Zr, Hf, V, Nb, Ta, Cr, Mo, W. And in some embodiments M¹ is selectedfrom the group consisting of Fe, Mn, Ni, Co, Cu, Zn, Cd, Ge, Si, Sn, Sb,Ga, Ru, Ir, Pd, Pt, Au, Rh, Re, B, In and Al.

M² is a metal atom, preferably selected from the group consisting of B,Al, In, Sn, Bi, Sn, Zn, Pb, Sb and Ga. R is a ligand for M² and can beany ligand, preferably a metalorganic ligand, more preferably anorganometallic ligand, most preferably an alkane ligand, such as ethylligand.

X_(y) is one or more ligands for M¹. Each X may be a halogen ligandselected from the group consisting of I, Br, Cl and F. However, in someembodiments at least one X can be a metalorganic ligand, such as acyclopentadienyl (for example, cyclopentadienyl, methylcyclopentadienyl,pentamethylcyclopentadienyl, ethylcyclopentadienyl,isopropylcyclopentadienyl, tertbutylcyclopentadienyl, and indenyl),alkoxide (for example, methoxide, ethoxide, isopropoxide, andtertbutoxide), alkyl (for example, methyl, ethyl, propyl, and butyl),carbonyl, cyclo-octadiene, benzene or hydrogen ligand. In otherembodiments X_(y) may comprise mixtures thereof. However, at least oneof the X_(y) ligands is preferably a halogen. As an example,bis(cyclopentadienyl)hafnium dichloride orbis(cyclopentadienyl)tantalum(V) trichloride, can be used as a metalprecursor in some embodiments.

The protective treatment may comprise exposure to a treatment agentselected from the group consisting of monosilane, disilane, trisilane,borane, diborane, triborane, etc. In some embodiments, the protectivetreatment is a disilane or a trisilane that is applied during or aftereach layer is deposited, before any layers are deposited, after onlysome layers are deposited, or after all the layers have been deposited.The protective treatment can be applied in a pulse or as a soak and as aliquid or as a vapor.

In preferred embodiments, M² is a metal, preferably aluminum, and R is acarbon-containing ligand. M²R₃ preferably has at least onemetal-to-carbon bond. In some embodiments, M²R₃ may be considered acarbon source chemical. In some embodiments, M²R₃ is selected from thegroup consisting of TMA and TEA.

One benefit of the ALD processes of some embodiments is that the growthrate is extremely high for an ALD process or a quasi-ALD process. Forexample, the growth rate for TaC formation can be over 2 Å/cycle.Further, annealing can be performed after the metal carbide depositionfor enhancing the properties of the film. Suitable atmospheres, such asN₂ or forming gas (N₂/H₂), may be used during annealing.

Exemplary pulsing sequences for TiC film formation include:

(TiCl₄+purge+trimethylaluminum (TMA) or triethylaluminum(TEA)+purge+protective treatment+purge)]×m₂

and

(TiCl₄+purge+protective treatment+purge+TMA or TEA+purge)]×m₂,

-   -   wherein m₂ is the number of total cycles and the protective        treatment is selected from the group consisting of monosilane,        disilane, trisilane, borane, diborane, triborane, etc.

Films deposited using the above exemplary pulsing sequence contained,based on an atomic basis, about 17-20% Ti, about 17-27% Al, about 16-42%Si, and about 21-39% C. In some films, Al may be as much as about 40% onan atomic basis. These values were determined using Rutherfordbackscattering spectrometry, or RBS.

In other embodiments, a protective treatment is not utilized every cyclebut only in some of the cycles. In this situation, a general pulsingsequence for carbon-containing metal thin film deposition can be:

[n₃×(M¹X_(y)+purge+M²R₃+purge)+m₃×(protective treatment+purge)]×k₃,

-   -   wherein n₃ is the number of carbide cycles in one total cycle,        m₃ is the number of cycles in which a protective treatment is        used in one total cycle, and k₃ is the number of total cycles.

M¹ is preferably Ti but may be a metal atom selected from the groupconsisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Si and Al. In otherembodiments M¹ can be selected from the group consisting of Fe, Mn, Ni,Co, Cu, Zn, Cd, Ge, Si, Sn, Sb, Ga, Ru, Ir, Pd, Pt, Au, Rh, Re, B, In.M² is preferably Al but may be a metal atom selected from the groupconsisting of B, Al, In, Sn, Bi, Zn, Pb, Sb and Ga. R is a ligand for M²and can be any ligand.

X_(y) is one or more ligands for M¹. Each X is preferably a halogenligand selected from the group consisting of I, Br, Cl and F. However,in some embodiments at least one X can be a metalorganic ligand, such asa cyclopentadienyl (for example, cyclopentadienyl,methylcyclopentadienyl, pentamethylcyclopentadienyl,ethylcyclopentadienyl, isopropylcyclopentadienyl,tertbutylcyclopentadienyl, and indenyl), alkoxide (for example,methoxide, ethoxide, isopropoxide, and tertbutoxide), alkyl (forexample, methyl, ethyl, propyl, and butyl), carbonyl, cyclo-octadiene,benzene or hydrogen ligand. In other embodiments X_(y) may comprisemixtures thereof. However, at least one of the X_(y) ligands ispreferably a halogen. As an example, bis(cyclopentadienyl)hafniumdichloride or bis(cyclopentadienyl)tantalum(V) trichloride, can be usedas a metal precursor in some embodiments.

Use of a protective treatment as disclosed herein has the potential ofproviding a thin film, such as a TiC, with resistance to oxidationduring subsequent processing. Without being tied to any particulartheory, it is believe that resistance to oxidation is increased in partbecause the protective treatment tends to decrease the amount of carbonin the thin film as it is partially replaced by silicon or boron or someother element comprising the protective treatment.

Metal Nitride Films

According to some embodiments, an ALD or quasi-ALD process is used toform titanium nitride thin films on substrates, such as integratedcircuit workpieces. The surfaces on which the thin titanium nitride(TiN) films are deposited can take a variety of forms. Examples include,but are not limited to, hafnium oxide, silicon, silicon oxide (SiO₂),coated silicon, dielectric materials, low-k materials, metals—such ascopper and aluminum—metal alloys, metal oxides and various nitrides,such as transition metal nitrides and silicon nitride or a combinationof said materials.

In a some embodiments, a substrate or workpiece is placed in a reactionchamber and subjected to alternately repeated surface reactions. Inparticular, thin films are formed by repetition of an ALD cycle. EachALD cycle is typically self-limiting, though, as discussed above, thereaction conditions may be modified to achieve a quasi-ALD process, suchas where a true ALD process would require an undesirable amount of timeto perform. In the case of compound metallic thin film deposition, atleast two different source chemicals are alternatively employed. Onereactant may form no more than about one monolayer on the substratesurface and includes a metal species desired in the layer beingdeposited. This reactant, also referred to herein as “the metalreactant,” is preferably a titanium halide, and thus the deposited layeris terminated with halogen ligands.

A second reactant preferably contributes nitrogen. In some embodiments,the second reactant comprises NH₃, hydrazine, or radicals/ions of N andH (for example in a PEALD process) or other known nitrogen compound foruse in ALD.

In some embodiments according to the present disclosure, a thirdreactant is provided every cycle, after a certain number of cycles, orafter deposition of the TiN film is complete. The third reactant may bea protective treatment agent, and may comprise a silicon compound or aboron compound, preferably one that can reduce at least a portion of anyoxidized TiN. In other words, the protective treatment may act to reducetitanium-oxygen bonds to restore the titanium-nitride bonds. In someembodiments the third reactant comprises a silane or a borane, such asmonosilane, disilane, trisilane, borane, diborane, triborane, etc.

The protective treatment is more reactive to oxygen than is titanium andthus is capable of reducing the amount of titanium oxide in the film. Insome cases, little or no oxygen is actually removed from the thin film;however, the protective treatment acts to reduce titanium oxide bybreaking the bonds between titanium and oxygen to return the titanium toits pure titanium carbide form. In such cases, although, the oxygen hasnot actually been removed from the film, it is bound up by theprotective treatment so as to not impede the workfunction of the TiNfilm or a film deposited prior or subsequent to the TiN film.Accordingly, it could also be said that application of a protectivetreatment increases the amount of TiN compared to the amount of TiON inthe film. Moreover, in some embodiments the third reactant also providesa species desired in the thin film, such as silicon or boron.

The protective treatment may be provided in each ALD cycle, at intervalsduring the deposition process, or after the deposition process has beencompleted. For example, in some embodiments the protective treatment isprovided every one to four ALD cycles. In some embodiments, at the timethe protective treatment is provided, the film grown in the most recentALD cycle is preferably thin enough that the protective treatment canpenetrate the film. In some embodiments, such as situations where morethan one deposition cycle have been completed prior to exposure to theprotective treatment, the amount of penetration or diffusion in thefilms can be controlled any number of factors, such as duration,temperature, pressure, selection of the protective treatment, quantityor concentration of the barrier material used, etc.

The protective treatment may be provided as a part of one or more cyclesor may be applied after one or more cycles have been completed. Thus, insome embodiments, the deposition of a metal nitride film, such as TiN,is considered to be a cycle in an ALD process independent of theapplication of a protective treatment. In such cases, the cycle isrepeated as many times as desired, and the treatment using a protectivetreatment is applied after some or all of the cycles. However, in someembodiments, the protective treatment is applied during one or morecycles (as a part of an ALD cycle) as well as after one or more cycles(separate from an ALD cycle).

In one phase of an ALD cycle (“the titanium phase” or the “firstphase”), the reactant or source chemical comprising titanium is suppliedto the reaction chamber and chemisorbs to the substrate surface. Thereactant supplied in this phase is selected such that, under thepreferred conditions, the amount of reactant that can be bound to thesurface is determined by the number of available binding sites and bythe physical size of the chemisorbed species (including ligands). Thechemisorbed layer left by a pulse of the titanium reactant is ideallyself-terminated with a surface that is non-reactive with the remainingchemistry of that pulse. This phenomenon is referred to herein as“self-saturation.” One of skill in the art will recognize that theself-limiting nature of this phase makes the entire ALD cycleself-limiting. Excess reactant and reactant byproducts (if any) areremoved from the reaction space, for example by purging with an inertgas and/or evacuation.

However, in some embodiments, the purge step may be insufficiently longto fully clear the reaction space of precursors before the nextprecursor is pulsed through the reaction space. In some cases, fullevacuation or purging may require a period of time that is noteconomical or efficient. Moreover, some precursors may actuallydecompose or partially decompose within the reaction space.

In the next phase of the cycle, a pulse of a second source chemical isprovided that reacts with the molecules left on the substrate surface bythe preceding pulse. In some embodiments the source chemical preferablycomprises nitrogen that is to be incorporated in the thin film. Thenitrogen is incorporated into the thin film by the interaction of thesource chemical with the monolayer left by the metal reactant. Thisphase is referred to herein as “the second phase” or the“nitrogen-contributing phase.” In some embodiments, the second sourcechemical is a nitrogen-containing compound and its reaction with thechemisorbed metal species produces a metal nitride layer on thesubstrate.

Excess second source chemical and reaction byproducts, if any, areremoved from the reaction space by purging and/or evacuation.

In some embodiments, a third phase of the ALD cycle comprises providingthe protective treatment agent. In the some embodiments the protectivetreatment agent removes or isolates oxygen from the growing thin filmand/or reacts with oxygen preferentially relative to the other metals inthe growing film. In addition, the protective treatment agent maycomprise a species that may be incorporated into the thin film, such asboron or silicon. This is referred to as the “third phase” or the“oxygen isolation phase.”

Although referred to as the “first phase,” the “second phase” and the“third phase,” these labels are for convenience and do not indicate theactual order of the phases in each ALD cycle. Thus, the initial ALDcycle may be started with any of the three phases described above.However, one of skill in the art will recognize that if the initial ALDcycle does not begin with the metal reactant phase, at least two ALDcycles will typically need to be completed to deposit about a monolayerof the desired metal nitride thin film.

In addition, the order of the phases may be changed. That is, in someembodiments the protective treatment may be the next reactant providedafter the second reactant, while in other embodiments the protectivetreatment may be the next reactant provided after the first metal sourcereactant. In some embodiments, the protective treatment is suppliedbefore any other reactants and may be supplied only initially ascompared to as a part of cycle or after all the cycles are completed.And in some embodiments, the protective treatment may be supplied afteronly some cycles or after all cycles have been completed. For example,in some embodiments the third phase (provision of the protectivetreatment) may immediately follow the first phase (provision of thereactant comprising a metal species), which in turn is followed by thenitrogen-contributing phase. And in some embodiments, the third phasemay be supplied as a “soak,” after the thin film has been completelyformed. That is, the deposited film is exposed to a silane or a boranefor a more extended period of time. A phase is generally considered toimmediately follow another phase if only a purge or other reactantremoval step intervenes.

In some embodiments the protective treatment agent is not provided inevery ALD cycle. Rather, a partially or completely deposited titaniumnitride film may be treated with a protective treatment. This may be thecase, for example, where a first TiN film has been formed by has been oris likely to be oxidized by water, air, or some other contaminant sourceto form a layer that is essentially TiON. A protective treatment can beapplied to the first film to reduce the TiON layer back to essentiallyTiN with only the minor presence of impurities, such as oxygen, or toprevent oxidation of the Ti in the layer.

In one embodiment, an ALD cycle comprises:

-   -   1. providing a titanium halide to the reaction space;    -   2. substantially purging and/or evacuation of excess titanium        halide and reaction byproducts;    -   3. providing a nitrogen-contributing reactant to the reaction        space, such as NH₃;    -   4. substantially purging and/or evacuation of excess second        reactant and reaction byproducts; and    -   5. providing a protective treatment to the reaction space.

Step 5 can be included in each ALD cycle, or steps 1-4 can be repeatedseveral times before step 5 is introduced. In some embodiments steps 1-4are repeated up to 10 times before step 5 is included. In otherembodiments steps 1-4 are repeated up to 100 or even 1000 or more timesbefore step 5 is included. In some embodiments, a complete film ofdesired thickness is deposited prior to step 5.

With reference again to FIG. 5, in an embodiment of the invention, afterinitial surface termination, if necessary, a first reactant or sourcechemical pulse is supplied 502 to the substrate or workpiece. In theillustrated embodiment, the first reactant is a metal halide, and thethin film being formed comprises a metal nitride. In accordance with apreferred embodiment, the first reactant pulse comprises a carrier gasflow and a volatile titanium halide species that is reactive with theworkpiece surfaces of interest. Accordingly, the halogen-containingtitanium species adsorbs upon the workpiece surfaces. The first reactantpulse self-saturates the workpiece surfaces such that any excessconstituents of the first reactant pulse do not further react with themonolayer formed by this process. Self-saturation results due to halidetails terminating the monolayer, protecting the layer from furtherreaction.

The first reactant is then removed 304 from the reaction space. Step 504may entail merely stopping the flow of the first reactant or chemistrywhile continuing to flow a carrier gas for a sufficient time to diffuseor purge excess reactants and reactant by-products from the reactionspace. Preferably the removal 504 comprises continuing to flow purge gasfor between about 0.1 seconds and 20 seconds after stopping the flow ofthe first reactant pulse. Together, the adsorption 502 and reactantremoval 504 represent a first phase 505 in an ALD cycle. The first phasein the illustrated ALD cycle is thus the metal phase.

With continued reference to FIG. 5, a second reactant or source chemicalpulse is then supplied 506 to the workpiece. The second chemical reactswith the monolayer left by the first reactant. In the illustratedembodiment, this second reactant pulse 506 comprises supplying a carriergas with the second source gas to the workpiece. In particular, wherethe first reactant comprises a titanium halide, the second reactant, maybe a nitrogen compound such as NH₃. The second reactant preferablyremoves at least some halide ligands from the adsorbed first reactantleaving no more than about a monolayer of TiN. The second reactant pulse506 also leaves a surface termination that operates to limit thedeposition in a saturative reaction phase.

After a time period sufficient to completely saturate and react themonolayer with the second reactant pulse 506, any excess second reactantis removed 308 from the workpiece. As with the removal 504 of the firstreactant, this step 508 may comprise stopping the flow of the secondchemistry and continuing to flow carrier gas for a time periodsufficient for excess reactants and volatile reaction by-products fromthe second reactant pulse to diffuse out of and be purged from thereaction space. Together, the second reactant pulse 506 and removal 508represent a second phase 509 in the illustrated process, and can also beconsidered a nitrogen-contributing phase.

According to some embodiments, a residual amount of a metal, such asaluminum, is present in the chamber during the nitrogen-contributingphase. The metal may have been used in a previous phase. Because it ispresent during the nitrogen-contributing phase, it is possible for it tobe incorporated into the resulting metal nitride layer. For example, thedeposition of a TiN layer may actually produce at least some TiAlN.

When the excess reactants of the second reactant pulse have been removed508 from the chamber, a third reactant pulse may be supplied to theworkpiece 510. The third reactant can be a protective treatment agentcapable of removing halides and/or reacting with oxygen in the growingfilm. Examples of suitable protective treatment agents include silanesand boranes, for example in the form of monosilane, disilane, trisilane,borane, diborane, triborane, etc. The protective treatment agent may beprovided with an inert carrier gas. Temperature and pressure conditionscan be adjusted to control the level of diffusion of the protectivetreatment agent through the monolayer.

After a time period sufficient to achieve a desired level of saturationof the third reactant in the monolayer, excess unreacted protectivetreatment agent and any reaction by-products (which may also bevolatile) are removed 512 from the reaction space, for example by apurge gas pulse. The removal can be as described for steps 504 or 508.Together, the protective treatment pulse 510 and removal 512 represent athird phase 513 of the illustrated ALD process, which can also bereferred to as the oxygen isolation phase.

The combination of first phase 305, second phase 509, and third phase513, can be considered as a single deposition cycle 515. In someembodiments, the ordering of the third phase 513 actually precedeseither or both the first phase 505 and the second phase 509. In someembodiments, the third phase 513 is included in only some or only onedeposition cycle 515.

In some embodiments, supply of a protective treatment agent immediatelyfollows the step of removing excess first reactant and by-products.After a time period sufficient to react the monolayer with theprotective treatment agent, excess unreacted protective treatmentmaterials and reaction by-products are removed from the reaction space,possibly by a purge gas pulse. The removal step is followed by supply ofthe second reactant pulse.

In some embodiments of the disclosure (not illustrated), the steps ofsupplying the protective treatment and removing any excess protectivetreatment materials and by-products precede the step of supplying thefirst reactant. In some embodiments, the protective treatment is notprovided in every cycle or may be provided after all the cycles arecomplete.

In some embodiments, the step of supplying a protective treatment agenttakes the form of a soak occurring after some or all of the titaniumnitride deposition cycles have been completed. In some cases, a soak oftrisilane occurring after deposition of a TiN film is completed has beenfound to achieve suitable results.

In one embodiment, a process for forming a titanium nitride filmcomprises:

-   -   1. providing a titanium halide, such as a titanium chloride, to        the reaction space;    -   2. substantial purging and/or evacuation of excess titanium        halide and reaction byproducts;    -   3. providing a second reactant or a nitrogen-contributing        reactant, such as NH₃, hydrazine, or radicals/ions of N and H        (used in a PEALD process), to the reaction space;    -   4. substantially purging and/or evacuation of excess second        reactant and reaction byproducts;    -   5. repeating steps 1 through 4 at least once or for either a        desired number of cycles or until a film of a desired thickness        has been achieved; and    -   6. subjecting the product of step 5 to a soak with a protective        treatment agent comprising silane and/or borane.

The soak of Step 6 can be configured to achieve a particular level ofinteraction between any oxygen present in the film and the protectivetreatment agent. For example, the soak may last long enough tosubstantially diffuse throughout the film or the soak's duration may bekept shorter so as to reach only a partial depth in the film. In someembodiments, a soak may serve to “coat” a thin film with an oxygenbarrier by providing silicon or boron in the film. In some embodiments,the protective treatment applied as a soak is trisilane.

According to some embodiments, it may be desirable to subject a thinfilm, such as metal nitride, to a protective treatment well after thefilm has been deposited but before proceeding with a subsequentdeposition process whether or not the subsequent process itself includesan oxygen barrier treatment.

In at least some of the aforesaid embodiments, any element used in anembodiment can interchangeably be used in another embodiment unless sucha replacement is not feasible.

It will be appreciated by those skilled in the art that various otheromissions, additions and modifications may be made to the methods andstructures described above without departing from the scope of theinvention. All such modifications and changes are intended to fallwithin the scope of the invention, as defined by the appended claims.

1. (canceled)
 2. A method of reducing oxidation at an interface betweentwo different metal-containing thin films comprising: providing asubstrate comprising a first metal-containing thin film; contacting thefirst metal-containing thin film with a silane compound or a boranecompound; after contacting the substrate with the silane compound orborane compound, depositing a second metal-containing thin film over thefirst thin film.
 3. The method of claim 2, wherein the firstmetal-containing thin film is directly over a dielectric material. 4.The method of claim 2, wherein the first metal-containing thin filmcomprises a metal selected from Ti, Ta, Hf, V, Nb, and Zr.
 5. The methodof claim 2, wherein the first metal-containing thin film is an etch stoplayer or barrier layer and the second metal-containing thin film is aworkfunction setting layer.
 6. The method of claim 2, wherein the firstmetal-containing thin film is a TiN, TiAlN, TaN or TiAlCN thin film. 7.The method of claim 2, wherein the second metal containing thin filmcomprises an n-type metal.
 8. The method of claim 2, wherein the secondmetal containing thin film comprises TiAl, TaC, HfC, TaAlC, TiAlSiC,TiAlB, TaAlB, TiAlSiB, TaAl, SiAlSiC or HfAlSiB.
 9. The method of claim2, wherein the second metal-containing thin film is a titanium carbidefilm.
 10. The method of claim 2, wherein contacting the firstmetal-containing thin film with a silane compound or borane compoundcomprises exposing the first metal-containing thin film to the silanecompound or borane compound for a duration of between about 1 second andabout 2 minutes.
 11. The method of claim 2, additionally comprisingcontacting the second metal-containing thin film with a silane or boranecompound.
 12. The method of claim 2 wherein depositing the secondmetal-containing thin film comprises an atomic layer deposition processcomprising multiple deposition cycles.
 13. The method of claim 11,wherein the substrate is exposed to a silane or borane compound in eachdeposition cycle.
 14. The method of claim 2, additionally comprisingdepositing a third metal-containing thin film over the secondmetal-containing thin film.
 15. The method of claim 13, wherein thesubstrate is contacted with a silane or borane compound during or afterdepositing the second metal-containing thin film and prior to depositingthe third metal-containing thin film.
 16. The method of claim 13,wherein the substrate is contacted with a silane or borane compoundduring or after deposition of the third metal-containing thin film. 17.The method of claim 15, additionally comprising depositing a metal thinfilm over the third metal-containing thin film.
 18. The method of claim16, wherein the metal thin film is a tungsten thin film.
 19. Thedeposition method of claim 2, wherein the silane or borane is selectedfrom the group consisting of monosilane, disilane, trisilane, borane,diborane, and triborane.
 20. The deposition method of claim 18, whereinthe silane or borane is trisilane.
 21. The deposition method of claim 2,wherein the first and second metal-containing thin films are depositedin situ.
 22. A method for depositing a metal layer over an etch stoplayer, the method comprising, sequentially: providing a substratecomprising an etch stop layer; contacting the etch stop layer with asilane compound or a borane compound; and depositing a metal-containinglayer over the first etch stop layer.
 23. The method of claim 22,wherein the etch stop layer is a titanium nitride layer and themetal-containing layer comprises an n-type metal.
 24. The method ofclaim 23, wherein the metal-containing layer comprises TiAl, TaC, HfC,TaAlC, TiAlSiC, TiAl B, TaAlB, TiAlSiB, TaAl, TiAlSiC TaAlSiB, orHfAlSiB.
 25. The method of claim 22, further comprising contacting themetal-containing layer with a silane or borane compound.
 26. The methodof claim 22, wherein the metal-containing layer is deposited by anatomic layer deposition process comprising multiple deposition cycles,and wherein the substrate is contacted with a silane or borane compoundduring at least one of the deposition cycles.
 27. The method of claim26, wherein the silane or borane is selected from the group consistingof monosilane, disilane, trisilane, borane, diborane, and triborane. 28.The deposition method of claim 22, wherein contacting the etch stoplayer with a silane compound or borane compound does not increase athickness of a first metal nitride layer.